Chip Quik TC3-10G Heat Sink Thermal Compound - Grey Ultra Max Conductive 10g Syringe 5cc
Product details
| Management number | 209981811 | Release Date | 2026/04/02 | List Price | $15.18 | Model Number | 209981811 | ||
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Lead-Free / RoHS 3 Compliant / REACH Compliant Description CHIPQUIK Ultra Max High Density Thermal Paste. Grey, non-curing, flowable, thermally conductive heat sink compound. Heavily filled with heat-conductive metal oxide. Provides extremely high thermal conductivity, low bleed and high temperature stability. Electrically insulating (4 x 10^13 ohm-cm). Specifications Viscosity: 87,000 cP (87,000 mPas) Density: 2.5g/cc Thermal Conductivity: 8.5 W/mK Thermal Resistance: 0.03 C*cm2/W Electrical Volume Resistivity: 4 x 10^13 ohm-cm Operating Temperature (Continuous): -40 to 150C (-40 to 302F) Operating Temperature (Peak): 200C (392F) Size: 10g/5cc Syringe Storage and Handling Store refrigerated or at room temperature 3-25C (37-77F). Allow 4 hours for thermal paste to reach an application temperature of 20-25C (68-77F) before use. Shelf Life >24 months Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
| Material | Thermal Paste |
|---|---|
| Item Weight | 0.634 ounces |
| Part Number | TC3-10G |
| Manufacturer | Chip Quik |
| Item model number | TC3-10G |
| Batteries Included | No |
| Batteries Required | No |
| Package Dimensions | 4.02 x 2.13 x 0.71 inches |
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