Different Sizes of Heatsink Thermoelectric Cooler Cooling Peltier Plate Module (TEC1-12730)

Features: Get ice cold in minutes or heat to boiling by simply reversing the polarity, used for numerous applications such as CCD camera, picnic cooler, beverage cooler , alternate power sources, or even for your own custom car drink warmer/cooler.Since they consit primarily of semiconductor material sandwiched between ceramic plates and have no moving parts.It will even generate electricity if you apply heat to one side while keeping the other side cold.This device must be used in conjunction with a heat sink to avoid burned.Model: TEC1-12715("TE" is the abbreviation of Thermo-Electric)/ Max cooling power: 136.8W/ Operates from 0-15.4V DC and 0-15A/ ΔTmax: >=68 °C/ Operates from -50 °C to +100 °C/ Size: 40mm x 40mm x 3.6mmModel: TEC1-12712/ Max cooling power: 109W/ Operates from 0-15.4V DC and 0-12A/ Tmax: >=68 °C/ Operates from -50 °C to +100 °C/ Size: 40mm x 40mm x 3.3mm Model: TEC1-12705/ Max cooling power: 42.5W/ Operates from 0-15.4V DC and 0-5A/ Tmax: >=68 °C/ Operates from -50 °C to +100 °C/ Size: approx 40mm x 40mm x 3.9mmModel: TEC1-12710/ Max cooling power: 91.2W/ Operates from 0-15.4V DC and 0-10A/ Tmax: >=68 °C/ Operates from -50 °C to +100 °C/ Size: 40mm x 40mm x 3.4mmModel: TEC1-12704/ Max cooling power: 50.8W/ Operates from 0-15.4V DC and 0-5.2A/ Tmax:>= 68 °C/ Operates from -50 °C to +100 °C/ Size: 40mm x 40mm x 3.6mmModel: TEC1-12709/ Max cooling power: 82W/ Operates from 0-15.4V DC and 0-9A/ Tmax:>= 68 °C/ Operates from -50 °C to +100 °C/ Size: 40mm x 40mm x 3.5mmModel: TEC1-12706/ Operates from 0-13V DC and 0-6A/ Max cooling power: 51.4W/ Tmax: >=68 °C/ Operates from -50 °C to +100 °C/ Size: 40mm x 40mm x 3.8mmModel: TEC1-12730/ Maxiumu power consumption : 456W/ Output cooling power: 253W/ Operates from 0-15.2V DC and 0-30A/ Operates from -60 °C to +180 °C/ Size: 62mm x 62mm x 4.8mm

• It will even generate electricity if you apply heat to one side while keeping the other side cold.
• Since they consit primarily of semiconductor material sandwiched between ceramic plates and have no moving parts.
• This device must be used in conjunction with a heat sink to avoid burned.
• Used for numerous applications such as cooling your CPU, video card, NANO Reef, laser diode